000			01468cam a2200313 a 4500
999			_c26470 _d26470
001			1179789
003			AR-SmCIES
005			20221207101040.0
008			970304s1998 enka f 001 0 eng d
020			_a0471974013
040			_aDLC _bspa _carsmcies _darsmcies
041			_aeng _hger
080			_a621.315.59
082	0	0	_a621.3815 _221
100	1		_aBeck, Friedrich. _938
240	1	0	_aPräparationstechniken für die Fehleranalyse an integrierten Halbleiterschaltungen. _lInglés
245	1	0	_aIntegrated circuit failure analysis : _ba guide to preparation techniques / _cFriedrich Beck ; translated by Stephen S. Wilson.
260			_aChichester ; _aNew York : _bWiley, _cc1998.
300			_axiv, 173 p. : _bil. ; _c24 cm.
440		0	_aWiley series in quality and reliability engineering _939
504			_aIncluye bibliografía e índice analítico.
505	0		_aPurpose and importance of preparatory semiconductor analysis -- Opening the package. Chip insulation -- Wet chemical etching procedures for removing layers of the chip structure -- Crystallographic etching in the silicon -- Dry etching the plasma -- Microsectioning technology, metallography -- Appendix 1: advice on health and safety at work -- Appendix 2: list of manufacturers and suppliers
650		0	_aCircuitos integrados _940
650		0	_aSEMICONDUCTORES _941
650		0	_aFallos _942
650		0	_aEnsayos _943
650		0	_aElectronica _xConfiabilidad _944
942			_2udc _cBK